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IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Conference WebsiteEuroSimE is the leading European forum on thermal, mechanical, and multiphysics simulation and experiments in micro- and nano-electronics. Technical papers, industrial keynotes, and hands-on training sessions address reliability, warpage, and thermo-electric co-design for advanced packages. A student paper contest and vendor exhibition round out the programme, which is indexed in IEEE Xplore and Scopus.
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Apr 11-14, 2027
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