IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

ITherm is the Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, co-located with IEEE ECTC. Peer-reviewed papers, an industry short-course day, and a student design challenge cover chip-to-system thermal management, reliability modelling, and two-phase cooling technologies. A hardware demo session and joint ECTC keynote foster cross-disciplinary dialogue between packaging, materials, and thermal engineers.